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A brief discussion on the present situation of small precisi

Source:Industrial Xin Maoxin  Author: Xin Maoxin To update:2018-03-08 03:37:27 Click:
  Stamping die is a necessary process equipment for stamping production, and it is a technology intensive product. The quality, production efficiency and production cost of the stamping parts are directly related to the design and manufacture of the die. The level of mold design and manufacturing technology is one of the most important indicators to measure the level of manufacturing in a country. It determines the quality and efficiency of products and the developing ability of new products to a large extent. At present, it has been able to produce a multi position progressive die with the precision of step distance and the forming precision of about 2 m.
 
  Brief introduction of high speed continuous stamping die for small precision hardware
 
  The small precision hardware continuous mold belongs to the high-end mould of the mould industry. It has the characteristics of complex structure, high machining accuracy, fast stamping speed and long service life. Small metal high-speed continuous stamping die is widely applied in the electronics industry. It is also the most important tool for developing and producing new product components such as mobile phones and other mobile communication terminals. In the "11th Five-Year plan" of die industry, precision punching die, especially the small precision metal high-speed continuous stamping die closely related to the electronic information industry, is listed as the focus of development. In order to produce high precision and high stability stamping parts, the technical level of stamping die must be improved. With the development of microelectronics technology, integration and consumer terminals such as mobile phone, digital product is high, but its size and weight was decreased in the master amplitude, the internal requirements of various components are smaller, such as mobile phone and digital products, and connector supporting toward ultra small and thin, lead spacing the connector has been reduced to 0.5mm, 0.4mm, 0.3mm, which promoted the development of precision mold technology.